SOLID BUSBAR

AluminiumEC, 6101
CopperCu-ETP
CCACopper Clad Aluminium or Bimetal (Aluminium core with outer layer of Copper)
Finish Bare / Electro Plated (Tin, Nickle, Silver)

Properties of Busbar Materials

PropertyUnitsCopperCCAAluminium
AnnealedHalf Hard15% CuECE91E/6101
Min. ultimate tensile strengthMN/m²217235-300130-17060-85200
Modus of elasticityMN/m²95 X 10³120 X 10³85 X 10³69 X 10³65 X 10³
Density at 20 ℃kg/m³8.89 X 10³8.89 X 10³3.63 X 10³2.7 X 10³2.7 X 10³
Max. electrical resistivity at 20℃Ωm1.724 X 10⁻⁸1.777 X 10⁻⁸2.65 X 10⁻⁸2.826 X 10⁻⁸3.133 X 10⁻⁸
Min. electrical conductivity at 20℃1/Ωm58 X 10⁶56 X 10⁶37.7 X 10⁶35.4 X 10⁶31.9 X 10⁶
%IACS10097656155
Temp. coefficient of resistance at 20℃1/℃3.93 X 10⁻³3.93 X 10⁻³4.01 X 10⁻³4.03 X 10⁻³3.64 X 10⁻³
Coeff. of linear thermal expansion 20-100℃1/℃17 X 10⁻⁶17 X 10⁻⁶21.9 X 10⁻⁶23 X 10⁻⁶23 X 10⁻⁶
Melting point10831083658658600-650
Specific heatJ/kg/℃393.5393.5711.7921.1879.2
Thermal conductivityW/m2/℃3.85 X 10⁶3.85 X 10⁶2.38 X 10⁶2.22 X 10⁶1.8 X 10⁶

# Significant cost savings can be achieved using CCA in lieu of COPPER

*for busbars in indoor installations at 35°C ambient temperature and 65°C bar temperature.

** Derating Factors:

 

– Temperature rise

– Skin effect and skin depth

– Proximity effect

– No of bars in parallel

–  Enclosure material

–  Creep resistance

–  Fatigue resistance

–  Reactance

–  Vibration

–  Effect of coating

–  Heat loss – Convection, Radiation, Conduction

–  Short circuit: Electromagnetic forces, Thermal effects

Electroplating Options

 

 

Tin

– Effective protection against corrosion

– Easy to solder

– Temperature resistance up to 120 °C

 

 

Nickel

– High conductivity

– Easy to solder

– High temperature resistance (200 °C)

 

Silver

– High corrosion resistance

– Soldered under certain conditions

– High temperature resistance (260 °C)

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